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EVG 40 Substrate Top to Bottom Measurement System

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Price:
$4,080.00
SKU:
TESO295
Brand:
EVG
Condition:
Used
Availability:
Available
Quantity:
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Product Description

Substrate / wafer parameters
Substrate size up to 200 mm
Substrate thickness Max. 10 mm

Alignment stage Chuck alignment stage:
- Y: ± 5 mm
- X: ± 105 mm

Measurements:
- Accuracy < 0.5 μm (3σ
- Repeatability 0.4 μm (3σ)
- Reproducibility 0.4 μm (3σ)
- Throughput 40 – 80 measurements / hour
- Measurement types
- Top-to-Bottom (T/B) -InfraredTransmitted


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